Stress Management via Low Modulus Urethane Adhesives for Electronic Applications read how low modulus urethane adhesives have been used to resolve stress and heat management problems while displaying improved handling and processing qualities over silicones.
Thermal Management Performance and Attachment Reliability Using Urethane Film Adhesives. Find out about Aptek Laboratories' development of a method to produce the equivalent of a B-stage urethane film (termed B/C/B), with a variety of unique properties.(1.8MB)
Unique UV Urethane Adhesives, Coatings and Encapsulants Now Compete with Conventional Urethanes for Military and Space Applications. (915KB)
APTEK developed a hybrid epoxy based BGA underfill that is designed to be thermally conductive Read about client tests that were done to characterize the flow characteristics and the feasibility of the material for BGA underflow applications.(355KB)
Development, Evaluation, and Implementation of Thermally Conductive Component Attach Adhesives in Inline Curing SMT Assembly Processes See how Aptek Laboratories helped Boeing find a solution to an SMT Assembly Process problem.
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