Thermally Conductive / Electrically Insulative

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Product
Description
DIS-A-PASTE 2000-A/B

Urethane Adhesive

Thermally conductive urethane adhesive. Exceeds NASA outgassing requirements. Excellent adhesion/hydrolytic stability.
DIS-A-PASTE 2001-PMF

Urethane Adhesive

Designed to dissipate heat and bond dissimilar substrates with minimum stress. Pre-mixed, frozen, long pot-life version DIS-A-PASTE 2000-A/B for robotic applications.
DIS-A-PASTE 2003-A/B

Urethane Adhesive

Thermally conductive, long pot-life, two-component version of DIS-A-PASTE 2001-PMF. For customers with no freezer storage capacity.
DIS-A-PASTE 2006-A/B

Urethane Adhesive

Mineral filled, clear, two-component, electrically insulating, urethane adhesive designed specifically for bonding PVC and other plastic substrates. Capable of room-temperature or accelerated heat cure.
DIS-A-PASTE 2008-A/B

Urethane Adhesive

Two-component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed for the potting of sensors and to dissipate device generated heat.
DIS-A-PASTE 2310-PMF

Hybrid Urethane Adhesive

Snap-cure, thermally conductive adhesive for surface mount applications. Extremely low modulus for a non-silicone. Flexible to –75°C. Cures in seconds via re-flow processing. Service temperature up to 175°C (air)/225°C (N2).
DIS-A-PASTE 2311-PMF

Hybrid Epoxy Adhesive

Snap-cure, thermally conductive, long pot-life/stable viscosity- excellent for robotics. Minimal Z-axis movement during cure. Stronger than DIS-A-PASTE 2310-PMF.

Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.