Thermally Conductive / Electrically Insulative
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Thermally conductive urethane adhesive. Exceeds NASA outgassing requirements. Excellent adhesion/hydrolytic stability.
Designed to dissipate heat and bond dissimilar substrates with minimum stress. Pre-mixed, frozen, long pot-life version
DIS-A-PASTE 2000-A/B for robotic applications.
Thermally conductive, long pot-life, two-component version of
DIS-A-PASTE 2001-PMF. For customers with no freezer storage capacity.
Mineral filled, clear, two-component, electrically insulating, urethane adhesive designed specifically for bonding PVC and other plastic substrates. Capable of room-temperature or accelerated heat cure.
Two-component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed for the potting of sensors and to dissipate device generated heat.
Snap-cure, thermally conductive adhesive for surface mount applications. Extremely low modulus for a non-silicone. Flexible to –75°C. Cures in seconds via re-flow processing. Service temperature
up to 175°C (air)/225°C (N2).
Snap-cure, thermally conductive, long pot-life/stable viscosity- excellent for robotics. Minimal Z-axis movement during cure. Stronger than DIS-A-PASTE 2310-PMF.
Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.