Encapsulants & Potting Compounds

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Product
Description
APTEK 2100-A/B

Urethane Encapsulant and/or Potting Compound

General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications.
APTEK 2118-A/B

Urethane Encapsulant and/or Potting Compound

Unfilled urethane casting/tooling resin. Very high abrasion/tear strength. Capable of full cure at room temperature.
APTEK 2125-A/B

Urethane Encapsulant and/or Potting Compound

Two-component, lightweight, electrically insulating urethane system designed for the potting and encapsulation of electronic components, substrates, and active chips. This is 100% solids, solvent free system that will not form voids during cure or service life.
DIS-A-PASTE 2716-A/B

Silicone Encapsulant and/or Potting Compound

Two-component, filled, thermally conductive potting compound. It is designed for the potting and encapsulation of electrical/electronic components and substrates. Long pot life and low exotherm.
APTEK 6100-1A/B

Epoxy Encapsulant

Optoelectronic grade, water clear encapsulant for IR and visible LED discreet devices. Lower Tg versions available for display devices.
APTEK 6103-A/B

Epoxy Encapsulant

Optoelectronic grade, reddish black encapsulant for IR LED discreets. Transparent to IR light while blocking out visible light.
APTEK 6108-PMF

Epoxy Coating/Encapsulant

High temperature, rigid, electrical/electronic coating or encapsulant. Provides excellent environmental protection for continuous exposure to 220°C.
APTEK 6109-A/B

Epoxy Encapsulant

Optoelectronic grade flexible water clear encapsulant. Higher viscosity/lower Tg version for clear blob-top encapsulation of ceramic substrate devices
APTEK 6110-A/B

Epoxy Encapsulant and/or Potting Compound

Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. More flexible, ower Tg versionof APTEK 6106-A/B, for good temparaturecycling in ceramic devices.
APTEK 6114-2-PMF

IR Transmitting/Visible Light Blocking Optoelectronic Epoxy Encapsulant

One component, unfilled, dark brown, rigid system designed for the encapsulation of IR LED chips in OPTO devices. Provides excellent environmental protection and when casted becomes the lens portion of the device designed to be transparent to IR light while blocking out visible light and therefore appears black when cast in mass.
APTEK 6519-A/B

Low CTE Syntactic Foam Compound

Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification SCGMS 58001 Rev.L.
APTEK 6527-A/B

Low CTE Syntactic Foam Compound

Light-weight, filled, dark gray, two-component, room-temperature curing, epoxy syntactic foam designed to meet Hughes specification SCGMS 58001 Rev.L.
APTEK 6550-A/B

Epoxy Encapsulant

High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for robotic dispensers.

Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.