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Semi pourable, thixotropic staking compound or encapsulant. RT or heat cure. Low modulus, outgassing.
One component, premixed frozen, long pot-life version of APTEK 2205-A/B. Low modulus, low Tg for excellent low temperature cycling and performance. Also used as a damming compound.
RT or heat cure. Easy-to-use pre-measured kits. Fast set for production/repair applications. Excellent hydrolytic stability. Qualified to WS 23708-1. Highly thixotropic.
UV-cured, thixotropic, staking compound. Cures in shaded areas. Excellent adhesion to ceramics, metals, and plated substrates. Available in easy-to-use syringes.
UV-cured, one component, RT stable, versatile wire staking compound. Low ionics for electronic applications. Excellent adhesion to metal and plastic PCB substrates.
UV-cured, thixotropic, one component, electrically insulating, urethane system designed for the attachment and staking of electrical/electronic components. UVISTAKE 7207 is a thixotropic version of UVIBOND 7100.
Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.