Films & Pads
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Thermally conductive film, spacer, or pad for electronics. 5-100 mil thickness/custom shapes available. Softer, -80C Tg films –1300 Series.
Ultra-soft and compliant, thermally conductive blanket or gasket. Very low outgassing; -110°C Tg version for space applications.
B-staged, tack-free adhesive on both faces of a fully cured, C-staged, low modulus film designed to compensate for thermally mismatched devices/component PCB assembly applications. Easy to use compliant bonding material. Thermal and stress management system.
Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.