TECHNICAL DATA & INFORMATION – Click to view complete technical data
APTEK 6500-PMF is a one component, pre-mixed frozen, 100% solids, silver-filled epoxy adhesive specifically designed for microelectronic die attach applications.
KEY FEATURES AND BENEFITS
• High purity resin system for minimum level of ionic contamination to prevent corrosion problems
• High cross-link density to maintain stability and minimize outgassing during operational life even in high vacuum environments and sealed packages
• Smooth, thixotropic consistency for machine stamping applications. Viscosity can be factory controlled for screening or dispensing applications.
• Contains no diluents or solvents to minimize formation of voids during cure