Select a Underfill Adhesives product:
Hybrid Epoxy BGA Underfill for larger gaps
Higher viscosity version of DIS-A-PASTE 2150-PMF designed to allow for penetration of gaps with clearances of 0.030” – 0.050”.
Hybrid Epoxy BGA Underfill for smaller gaps
Low viscosity version of DIS-A-PASTE 2150-PMF designed to allow for penetration of gaps with clearances of 0.002 – 0.005”.
Hybrid Epoxy BGA Underfill
One-component, premixed-frozen, mineral filled, electrically insulating flexible underfill. It is designed to flow underneath BGA devices via capillary action and dissipate device-generated heat. Read a client test case article.
Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.