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Low modulus urethane thixotropic encapsulant

PRODUCT DESCRIPTION

APTEK 2100-A7C/B is a thixotropic, medium viscosity, two component, electrically insulating, low modulus urethane system designed for the encapsulation of electrical/electronic components to printed circuit boards.

Although  APTEK 2100-A7C/B is capable of achieving full cure at room temperature, however, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties.

KEY FEATURES AND BENEFITS

• 100% solids, solvent free system that will not form voids during cure or service life
• Low Tg for excellent low-temperature cycling and performance
• Very good substrate adhesion; superior to silicones
• Exceeds NASA outgassing requirements for high vacuum environments