TECHNICAL DATA & INFORMATION – Click to view complete technical
Low modulus urethane thixotropic encapsulant
APTEK 2100-A7C/B is a thixotropic, medium viscosity, two component, electrically insulating, low modulus urethane system designed for the encapsulation of electrical/electronic components to printed circuit boards.
Although APTEK 2100-A7C/B is capable of achieving full cure at room temperature, however, a short term exposure to moderate heat will greatly reduce processing time and optimize cured properties.
KEY FEATURES AND BENEFITS
• 100% solids, solvent free system that will not form voids during cure or service life
• Low Tg for excellent low-temperature cycling and performance
• Very good substrate adhesion; superior to silicones
• Exceeds NASA outgassing requirements for high vacuum environments