TECHNICAL DATA & INFORMATION – Click to view complete technical
Premixed-frozen, low modulus urethane thixotropic enapsulant
APTEK 2100A7C-PMF is a one-component, premixed-frozen, electrically insulating, low modulus urethane system designed for the encapsulation of electrical/electronic components on printed circuit boards.
APTEK 2100A7C-PMF is a 100% solids, solvent-free system that will not form voids during cure or outgas after being fully cured. This system is capable of achieving full cure at room temperature or cure can be accelerated with heat cure.
APTEK 2100A7C-PMF is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.
KEY FEATURES AND BENEFITS
• Premixed, deaired, and frozen version of APTEK 2100-A7C/B packaged in syringes for convenient dispensing – eliminates the need to weigh, mix, and degas
• Low modulus to minimize stress to sensitive components and ceramic substrates
• Low Tg for excellent low temperature cycling and performance
• Excellent substrate adhesion; superior to silicones