Select a Low Modulus, Electrically Insulative Potting Compound product:

APTEK 2100-A/B
Urethane Encapsulant and/or Potting Compound
General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications.

APTEK 2100-PMF
Urethane Encapsulant and/or Potting Compound
A pre-mixed and frozen version of APTEK 2100-A/B. This form packaging is convenient for the end-user where the product is ready to use after thaw. However, storage at -60C or below is required.

APTEK 2118-A/B
Urethane Encapsulant and/or Potting Compound
Unfilled urethane casting/tooling resin. Very high abrasion/tear strength. Capable of full cure at room temperature.

APTEK 2300-PMF
Premixed-frozen, low modulus, hybrid urethane, re-enterable encapsulant
A one component, pre-mixed and frozen, mineral-filled, electrically insulating soft paste designed to encapsulate and adhere to many dissimilar substrates. This product has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. The system displays higher ionic purity than epoxy systems minimizing the possibility of corrosion on components and circuitry.

APTEK 6113-A/B
Electrically Insulative, Epoxy, Potting Compound
A black, rigid, two component, mineral-filled, electrically insulative, low-shrinkage epoxy system specifically designed for the potting of larger electrical units like motor stators and transformers.

APTEK 6113-A/B2
Electrically Insulative, Epoxy Encapsulant/Potting Compound
A longer pot-life version of APTEK 6113-A/B for increased handling time at elevated temperatures.