Select a Low Modulus, Electrically Insulative Potting Compound product:

APTEK 2100-A/B
Urethane Encapsulant and/or Potting Compound
General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications.

APTEK 2100-PMF
Urethane Encapsulant and/or Potting Compound
A pre-mixed and frozen version of APTEK 2100-A/B. This form packaging is convenient for the end-user where the product is ready to use after thaw. However, storage at -60C or below is required.

APTEK 2118-A/B
Urethane Encapsulant and/or Potting Compound
Unfilled urethane casting/tooling resin. Very high abrasion/tear strength. Capable of full cure at room temperature.

APTEK 6113-A/B
Electrically Insulative, Epoxy, Potting Compound
A black, rigid, two component, mineral-filled, electrically insulative, low-shrinkage epoxy system specifically designed for the potting of larger electrical units like motor stators and transformers.

APTEK 6113-A/B2
Electrically Insulative, Epoxy Encapsulant/Potting Compound
A longer pot-life version of APTEK 6113-A/B for increased handling time at elevated temperatures.