Select a Electrically Conductive Adhesives product:
APTEK 2100ESD-A/B
ESD Urethane Adhesive
Space-grade, thixotropic, electrically conductive, flexible urethane adhesive designed to dissipate an electrostatic discharge.
APTEK 2100SF-A/B
Electrically Conductive Urethane Adhesive
Silver-filled, low modulus, low outgassing, urethane adhesive. Excellent adhesion to plastic metal substrates.
APTEK 2210-A/B
Urethane Adhesive
Silver-filled, low modulus, low outgassing, urethane adhesive. Excellent adhesion to ceramic, metal and PCB substrates.
APTEK 2214-A/B
Urethane Adhesive
Space-grade, low modulus, low outgassing, Brushable, urethane ESD coating/adhesive. RT or low heat cure. Surface resistivity 4×106 ohms/square.
APTEK 2217/0.005-PMF
Low Modulus Urethane Electrically Conductive, ESD, Adhesive
One-component, single component, pre-mixed and frozen, flexible urethane coating/adhesive designed to dissipate an electrostatic charge. This system provides a combination of high flexibility and good tensile strength/elongation characteristics. Contains 5 mil glass spacer beads to achieve a uniform bondline thickness.
APTEK 2312-PMF
Hybrid Urethane Adhesive
Snap-cure, one component, low modulus, low stress, silver-filled adhesive. Wide temperature operating range: -75 to +270°C (under N2). Service temperature up to 175°C (air). Also available in a Low Viscosity version.
APTEK 2312LV-PMF
Hybrid Urethane Adhesive
Snap-cure, one-component, low modulus, low stress, silver-filled adhesive. This is the lower viscosity version of APTEK 2312-PMF.
APTEK 2313-PMF
Hybrid Epoxy Adhesive
Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant. Also available in a Low Viscosity version.
APTEK 2313LV-PMF
Hybrid Epoxy Adhesive
Snap-cure, one-component, low Tg, silver-filled adhesive. Lower viscosity version of APTEK 2313-PMF.
APTEK 2713-A/B
Silicone Adhesive
Low modulus silicone adhesive. Very low Tg for excellent temperature cycling performance. Available premixed-frozen, or in convenient 1:1 dual cartridge kits.
APTEK 2717-A/B
Silicone Adhesive and/or ESD Coating
Two-component, black, low modulus, thixotropic, silicone adhesive displaying very low temperature flexibility and good physical strength properties. Designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solids system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.
APTEK 6500-PMF
Epoxy Adhesive
Ultra-high ionic purity, silver-filled, meets requirements of MIL-A-87172, very low residual gas analysis. Available with gold filler.
APTEK 6512-PMF
Epoxy Adhesive
Snap-cure, silver-filled, one–component;>20 hr flat-line viscosity-ideal for robotics;15 minute full cure @ 150°C.
APTEK 6516-A/B
Epoxy Adhesive
General purpose, electrically conductive adhesive. Convenient 1/1 PBW or PBV mix ratio. RT or heat cure.
APTEK 6521-A/B
Epoxy Adhesive
Carbon-filled, thixotropic, two component, electrically conductive, high strength epoxy coating/adhesive designed to dissipate an electrostatic charge. This low-outgassing system provides high strength over a wide temperature range.
APTEK 6521-PMF
Epoxy Adhesive
A one-component, pre-mixed and frozen, carbon-filled, ESD, high strength epoxycoating/adhesive designed to dissipate an electrostatic charge. This low-outgassing system provides high strength over a wide temperature range.
APTEK 6531-A/B
Epoxy Adhesive
Silver-filled, electrically-conductive, tough epoxy adhesive designed for the attachment of electrical/electronic components to printed circuit boards.
Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.
