TECHNICAL DATA & INFORMATION – Click to view complete technical

• Thermally conductive, silicone potting compound
• Re-enterable for repairability
• Wide operating temperature range (-100°C to +260°C)

PRODUCT DESCRIPTION

DIS-A-PASTE 2716-A/B is a two component, filled, thermally conductive potting compound. It is designed for the potting and encapsulation of electrical/electronic components and substrates.

KEY FEATURES AND BENEFITS

• Very low mixed viscosity to enhance the potting/encapsulation of intricate parts
• Long pot life and low exotherm for mass casting of parts up to 5” thick
• Very low Tg (-100°C) for excellent low temperature cycling and performance
• Excellent substrate adhesion when used in conjunction with G.E. SS 4155 primer or DC 1200 primer
• Available in dual cartridge kits for convenient dispensing to circuit board