Select a Low Modulus, Thermally Conductive Potting Compound product:

DIS-A-PASTE 2008-A/B
Urethane Adhesive
Two-component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed for the potting of sensors and to dissipate device generated heat.

DIS-A-PASTE 2716-A/B
Thermally conductive, silicone potting compound
Two component, filled, thermally conductive potting compound. It is designed for the potting and encapsulation of electrical/electronic components and substrates.

APTEK 6550-A/B
Thermally conductive, electrically insulating, “Blob Top” encapsulant
Two component, mineral-filled, epoxy system designed to encapsulate microelectronic chips and circuitry.

Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.