Select a Light Weight Potting Compound product:

APTEK 2125-A/B
Low modulus urethane, High purity, Low outgassing
Two component, lightweight, electrically insulating urethane system designed for the potting and encapsulation of electronic components, substrates, and active chips. This is 100% solids, solvent free system that will not form voids during cure or service life.

APTEK 6519-A/B
Low CTE, low outgassing, syntactic foam compound
is a light weight, rigid, filled, dark gray, two component, room-temperature curing, epoxy syntactic foam designed to meet Boeing Satellite Systems specification SCGMS 58001. APTEK 6519-A/B is a 100% solids, solvent-free system that will not outgas during cure or after being fully cured.

APTEK 6527-A/B
Low CTE, low outgassing, syntactic foam compound
A light weight, rigid, filled, dark gray, two component, room-temperature curing, epoxy syntactic foam. APTEK 6527-A/B is a 100% solids, solvent-free system that will not outgas during cure or after being fully cured.

Notes: The data shown are typical and are not recommended for specification purposes. Consult Aptek Technical Service for more information. These products represent part of our product line. To request other products specification qualifications and further data, please contact us. Refer to product Technical Data Sheets for complete characteristics and properties.