TECHNICAL DATA & INFORMATION – Click to view complete technical data

• Semi-rigid, electrically-conductive, epoxy adhesive
• RT cure; high strength

PRODUCT DESCRIPTION

APTEK 6539-PMF is a one-component, silver-filled, semi-rigid, high strength, electrically-conductive, epoxy adhesive. It is specifically designed to fully cure at room temperature or can be accelerated with moderate heat. This is 100% solids, solvent free system that will not form voids during cure or service life.

KEY FEATURES AND BENEFITS

• Contains the appropriate silver content to prevent hysteresis during temperature cycle.
• Reaches 80% of cured physical properties in 48 hours at 25°C (77°F).
• Contains no diluents or solvents to minimize formation of voids during cure.