TECHNICAL DATA & INFORMATION –  Click to view complete technical

• Premixed-frozen, low modulus, hybrid urethane, re-enterable encapsulant

PRODUCT DESCRIPTION

APTEK 2300-PMFis a one component, premixed-frozen, mineral-filled, electrically insulating soft paste designed to encapsulate and adhere to many dissimilar substrates. APTEK 2300-PMFis a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured.

APTEK 2300-PMFis a system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. This system displays higher ionic purity than epoxy systems minimizing the possibility of corrosion on components and circuitry.

KEY FEATURES AND BENEFITS

• Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates
• Low Tg for excellent low temperature cycling and performance
• Excellent substrate adhesion; superior to silicones
• Re-enterable for repair applications – save costly devices/PC boards
• Exceeds NASA outgassing requirements for high vacuum environments